Dicing tape
Encyclopedia
Dicing tape is a backing tape used during wafer dicing
, the cutting apart of pieces of semiconductor
material following wafer
microfabrication
. The tape holds the pieces of semiconductor, known as dies, together during the cutting process, mounting them to a thin metal frame. The dies are later removed from the dicing tape further on in the electronics
manufacturing process.
Dicing tape can be made of PVC
, polyolefin
, or polyethylene
backing material with an adhesive to hold the dies in place. It is available in a variety of thicknesses, from 75 to 150 micrometers, with a variety of adhesive strengths, designed for various chip sizes and materials. UV tapes are dicing tapes in which the adhesive bond is broken by exposure to UV light after dicing, allowing the adhesive to be stronger during cutting while still allowing clean and easy removal.
Wafer dicing
Wafer dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer. The dicing process can be accomplished by scribing and breaking, by mechanical sawing or by laser cutting...
, the cutting apart of pieces of semiconductor
Semiconductor
A semiconductor is a material with electrical conductivity due to electron flow intermediate in magnitude between that of a conductor and an insulator. This means a conductivity roughly in the range of 103 to 10−8 siemens per centimeter...
material following wafer
Wafer (electronics)
A wafer is a thin slice of semiconductor material, such as a silicon crystal, used in the fabrication of integrated circuits and other microdevices...
microfabrication
Microfabrication
Microfabrication is the term that describes processes of fabrication of miniature structures, of micrometre sizes and smaller. Historically the earliest microfabrication processes were used for integrated circuit fabrication, also known as "semiconductor manufacturing" or "semiconductor device...
. The tape holds the pieces of semiconductor, known as dies, together during the cutting process, mounting them to a thin metal frame. The dies are later removed from the dicing tape further on in the electronics
Electronics
Electronics is the branch of science, engineering and technology that deals with electrical circuits involving active electrical components such as vacuum tubes, transistors, diodes and integrated circuits, and associated passive interconnection technologies...
manufacturing process.
Dicing tape can be made of PVC
PVC
Polyvinyl chloride is a plastic.PVC may also refer to:*Param Vir Chakra, India's highest military honor*Peripheral venous catheter, a small, flexible tube placed into a peripheral vein in order to administer medication or fluids...
, polyolefin
Polyolefin
A polyolefin is a polymer produced from a simple olefin as a monomer. For example, polyethylene is the polyolefin produced by polymerizing the olefin ethylene. An equivalent term is polyalkene; this is a more modern term, although polyolefin is still used in the petrochemical industry...
, or polyethylene
Polyethylene
Polyethylene or polythene is the most widely used plastic, with an annual production of approximately 80 million metric tons...
backing material with an adhesive to hold the dies in place. It is available in a variety of thicknesses, from 75 to 150 micrometers, with a variety of adhesive strengths, designed for various chip sizes and materials. UV tapes are dicing tapes in which the adhesive bond is broken by exposure to UV light after dicing, allowing the adhesive to be stronger during cutting while still allowing clean and easy removal.