Die attachment
Encyclopedia
Die attachment is the step during the integrated circuit packaging
phase of semiconductor device fabrication during which a die is mounted and fixed to the package
or support structure.
For high-powered applications, the die is usually eutectic bonded onto the package, using e.g. gold-tin or gold-silicon solder
(for good heat conduction
). For low-cost, low-powered applications, the die is often glued directly onto a substrate (such as a printed wiring board) using an epoxy
adhesive
.
Integrated circuit packaging
Integrated circuit packaging is the final stage of semiconductor device fabrication per se, followed by IC testing.Packaging in ceramic or plastic prevents physical damage and corrosion and supports the electrical contacts required to assemble the integrated circuit into a system.In the integrated...
phase of semiconductor device fabrication during which a die is mounted and fixed to the package
Chip carrier
A chip carrier, also known as a chip container or chip package, is a container for a transistor or an integrated circuit. The carrier usually provides metal leads, or "pins", which are sturdy enough to electrically and mechanically connect the fragile chip to a circuit board. This connection may be...
or support structure.
For high-powered applications, the die is usually eutectic bonded onto the package, using e.g. gold-tin or gold-silicon solder
Solder
Solder is a fusible metal alloy used to join together metal workpieces and having a melting point below that of the workpiece.Soft solder is what is most often thought of when solder or soldering are mentioned and it typically has a melting range of . It is commonly used in electronics and...
(for good heat conduction
Heat conduction
In heat transfer, conduction is a mode of transfer of energy within and between bodies of matter, due to a temperature gradient. Conduction means collisional and diffusive transfer of kinetic energy of particles of ponderable matter . Conduction takes place in all forms of ponderable matter, viz....
). For low-cost, low-powered applications, the die is often glued directly onto a substrate (such as a printed wiring board) using an epoxy
Epoxy
Epoxy, also known as polyepoxide, is a thermosetting polymer formed from reaction of an epoxide "resin" with polyamine "hardener". Epoxy has a wide range of applications, including fiber-reinforced plastic materials and general purpose adhesives....
adhesive
Adhesive
An adhesive, or glue, is a mixture in a liquid or semi-liquid state that adheres or bonds items together. Adhesives may come from either natural or synthetic sources. The types of materials that can be bonded are vast but they are especially useful for bonding thin materials...
.