Dual in-line package
Overview
 
In microelectronics
Microelectronics
Microelectronics is a subfield of electronics. As the name suggests, microelectronics relates to the study and manufacture of very small electronic components. Usually, but not always, this means micrometre-scale or smaller,. These devices are made from semiconductors...

, a dual in-line package (DIP or DIL) is an electronic device package
Integrated circuit packaging
Integrated circuit packaging is the final stage of semiconductor device fabrication per se, followed by IC testing.Packaging in ceramic or plastic prevents physical damage and corrosion and supports the electrical contacts required to assemble the integrated circuit into a system.In the integrated...

 with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted
Through-hole technology
Through-hole technology, also spelled "thru-hole", refers to the mounting scheme used for electronic components that involves the use of leads on the components that are inserted into holes drilled in printed circuit boards and soldered to pads on the opposite side either by manual assembly by...

 to a printed circuit board
Printed circuit board
A printed circuit board, or PCB, is used to mechanically support and electrically connect electronic components using conductive pathways, tracks or signal traces etched from copper sheets laminated onto a non-conductive substrate. It is also referred to as printed wiring board or etched wiring...

 or inserted in a socket.

A DIP is usually referred to as a DIPn, where n is the total number of pins. For example, a microcircuit package with two rows of seven vertical leads would be a DIP14. The photograph at the upper right shows three DIP14 ICs.
DIPs are commonly used for integrated circuit
Integrated circuit
An integrated circuit or monolithic integrated circuit is an electronic circuit manufactured by the patterned diffusion of trace elements into the surface of a thin substrate of semiconductor material...

s (ICs).
 
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