FMC - FPGA Mezzanine Card
Encyclopedia
FMC
is an ANSI/VITA standard ANSI/VITA 57.1-2008 that defines I/O mezzanine modules with connection to an FPGA or other device with reconfigurable I/O capability. The low profile design allows use on popular industry standard
slot card, blade and low profile motherboard
form factor
s. The compact size is highly adaptable to many configuration needs and compliments existing common low profile mezzanine technology.
The FMC specification defines:
• IO mezzanine modules, which connect to carrier cards
◦ Low profile design allows use on popular industry standard slot card, blade and motherboard form factors, including VME, VPX, CompactPCI, AdvancedTCA, MicroTCA, PCI, PXI, and many other low profile motherboards. The compact size is highly adaptable to many configuration
needs and compliments existing common low profile mezzanine technology such as PMC, XMC, and AMC.
• A high-speed connector family of connectors for IO mezzanine modules
◦ Supporting up to 10 Gb/s transmission with adaptively equalized I/O
◦ Supporting single ended and differential signaling up to 2 Gb/s
◦ Numerous I/O
available
• The electrical connectivity of the IO mezzanine module high-speed connector
◦ Supporting a wide range of signaling standards
◦ System configurable I/O functionality
◦ FPGA intimacy
• The mechanical properties of the IO mezzanine module
◦ Minimal size
◦ Scalable from low end to high performance applications
◦ Conduction and ruggedized support
The FMC specification has two defined sizes that are referred to as a single width, and a double width module. The single width module has a width of 69mm and the double width module has a width of 139mm. The depth of both is 76.5mm.
The FMC mezzanine module uses a high-pin count 400 pin high-speed array connector, HPC. A mechanically compatible low-pin count, LPC, connector with 160 pins can also be used with any of the form factors detailed in this standard.
is an ANSI/VITA standard ANSI/VITA 57.1-2008 that defines I/O mezzanine modules with connection to an FPGA or other device with reconfigurable I/O capability. The low profile design allows use on popular industry standard
Industry Standard
Industry Standard is a 1982 album by The Dregs. It is their only album featuring vocals and garnered the group their fourth Grammy nomination.-Track listing:All tracks are written by Steve Morse, except where noted.#"Assembly Line" – 4:25...
slot card, blade and low profile motherboard
Motherboard
In personal computers, a motherboard is the central printed circuit board in many modern computers and holds many of the crucial components of the system, providing connectors for other peripherals. The motherboard is sometimes alternatively known as the mainboard, system board, or, on Apple...
form factor
Form factor
Form factor may refer to:*Form factor or emissivity, the proportion of energy transmitted by that object which can be transferred to another object...
s. The compact size is highly adaptable to many configuration needs and compliments existing common low profile mezzanine technology.
The FMC specification defines:
• IO mezzanine modules, which connect to carrier cards
◦ Low profile design allows use on popular industry standard slot card, blade and motherboard form factors, including VME, VPX, CompactPCI, AdvancedTCA, MicroTCA, PCI, PXI, and many other low profile motherboards. The compact size is highly adaptable to many configuration
Configuration
The term configuration has several meanings.In computing it may refer to:* Computer configuration or system configuration* Configure is the output of Autotools and used to detect system configuration...
needs and compliments existing common low profile mezzanine technology such as PMC, XMC, and AMC.
• A high-speed connector family of connectors for IO mezzanine modules
◦ Supporting up to 10 Gb/s transmission with adaptively equalized I/O
◦ Supporting single ended and differential signaling up to 2 Gb/s
◦ Numerous I/O
I/O
I/O may refer to:* Input/output, a system of communication for information processing systems* Input-output model, an economic model of flow prediction between sectors...
available
• The electrical connectivity of the IO mezzanine module high-speed connector
◦ Supporting a wide range of signaling standards
◦ System configurable I/O functionality
◦ FPGA intimacy
• The mechanical properties of the IO mezzanine module
◦ Minimal size
◦ Scalable from low end to high performance applications
◦ Conduction and ruggedized support
The FMC specification has two defined sizes that are referred to as a single width, and a double width module. The single width module has a width of 69mm and the double width module has a width of 139mm. The depth of both is 76.5mm.
The FMC mezzanine module uses a high-pin count 400 pin high-speed array connector, HPC. A mechanically compatible low-pin count, LPC, connector with 160 pins can also be used with any of the form factors detailed in this standard.