List of AMD Fusion microprocessors
Encyclopedia
This is a list of microprocessors designed by Advanced Micro Devices
, under the AMD Fusion
product series.
Advanced Micro Devices
Advanced Micro Devices, Inc. or AMD is an American multinational semiconductor company based in Sunnyvale, California, that develops computer processors and related technologies for commercial and consumer markets...
, under the AMD Fusion
AMD Fusion
AMD Fusion is the marketing name for a series of APUs by AMD. There are two flavors of Fusion currently available, one with its CPU logic based on the Bobcat core and the other its CPU logic based on the 10h core. In both cases the GPU logic is HD6xxx, which itself is based on the mobile variant of...
product series.
"Llano" (32 nm)
- All models feature upgraded Stars (AMD 10h architecture) codenamed Husky CPU cores (K10.5) with no L3 cache
- All A and E series models feature Redwood-class integrated graphics on die (BeaverCreek for the dual-core variants and WinterPark for the quad-core variants). Athlon models exclude integrated graphics.
- All models are manufactured on GlobalFoundriesGLOBALFOUNDRIESGlobalFoundries Inc. is the world's third largest independent semiconductor foundry, with its headquarters located in Milpitas, California. GlobalFoundries was created by the divestiture of the manufacturing side of AMD on March 2, 2009, and was expanded through its merger with Chartered...
' 32 nm SOI process for socketCPU socketA CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board . This allows the CPU to be replaced without soldering....
FM1. - All models support 4 DIMMDIMMA DIMM or dual in-line memory module, comprises a series of dynamic random-access memory integrated circuits. These modules are mounted on a printed circuit board and designed for use in personal computers, workstations and servers...
s of up to DDR3-1866 memory, with 5 GT/s UMIUMIUMI may refer to:* Universal Mobile Interface * Universal Metering Interface * Urban Ministries, Inc. * The former name of ProQuest, a microfilm and electronic archive...
. - All models have an integrated PCIe 2.0 controller.
- Select models support AMD's Turbo Core technology for faster CPU operation when the thermal specification permits.
- Select models support Hybrid Graphics technology to assist a discrete Radeon HD 6450, 6550, or 6570 discrete graphics card. This is similar to the current Hybrid CrossFireX technology available in the AMD 700 and 800 chipset series.
- All models support: MMX, SSEStreaming SIMD ExtensionsIn computing, Streaming SIMD Extensions is a SIMD instruction set extension to the x86 architecture, designed by Intel and introduced in 1999 in their Pentium III series processors as a reply to AMD's 3DNow! . SSE contains 70 new instructions, most of which work on single precision floating point...
, SSE2SSE2SSE2, Streaming SIMD Extensions 2, is one of the Intel SIMD processor supplementary instruction sets first introduced by Intel with the initial version of the Pentium 4 in 2001. It extends the earlier SSE instruction set, and is intended to fully supplant MMX. Intel extended SSE2 to create SSE3...
, SSE3SSE3SSE3, Streaming SIMD Extensions 3, also known by its Intel code name Prescott New Instructions , is the third iteration of the SSE instruction set for the IA-32 architecture. Intel introduced SSE3 in early 2004 with the Prescott revision of their Pentium 4 CPU...
, SSE4a, Enhanced 3DNow!3DNow!3DNow! is an extension to the x86 instruction set developed by Advanced Micro Devices . It adds single instruction multiple data instructions to the base x86 instruction set, enabling it to perform simple vector processing, which improves the performance of many graphic-intensive applications...
, NX bitNX bitThe NX bit, which stands for No eXecute, is a technology used in CPUs to segregate areas of memory for use by either storage of processor instructions or for storage of data, a feature normally only found in Harvard architecture processors...
, AMD64, Cool'n'QuietCool'n'QuietCool'n'Quiet is a CPU speed throttling and power saving technology introduced by AMD with its Athlon 64 processor line. It works by reducing the processor's clock rate and voltage when the processor is idle. The aim of this technology is to reduce overall power consumption and lower heat...
, AMD-V, Turbo Core (AMD equivalent of Intel Turbo BoostIntel Turbo BoostIntel Turbo Boost is a technology implemented by Intel in certain versions of their Nehalem- and Sandy Bridge-based CPUs, including Core i5 and Core i7 that enables the processor to run above its base operating frequency via dynamic control of the CPU's "clock rate". It is activated when the...
) - Transistors: 1.45 billion
- DieDie (integrated circuit)A die in the context of integrated circuits is a small block of semiconducting material, on which a given functional circuit is fabricated.Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon or other semiconductor through processes such as...
size: 228 mm²
| Model Number | | Step. | | CPU | | GPU | | Memory Support | | TDP Thermal Design Power The thermal design power , sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat... | | Released | | Part Number(s) | |||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Cores | Freq. | Turbo | L2 Cache | Multi1 !! Vcore CPU core voltage The CPU core voltage is the power supply voltage supplied to the CPU , GPU, or other device containing a processing core... !! Model !! Config2 !! Freq. |
||||||||||
| E2-3200 | B0 | 2 | 2.4 GHz | 2 × 512 KB | 24× | 0.9125 - 1.4125 | HD 6370D | 160:8:4 | 443 MHz | DDR3-1600 | 65 W | Q4 2011 | ED3200OJZ22GX ED3200OJGXBOX |
|
| A4-3300 | B0 | 2 | 2.5 GHz | rowspan="2" | 2 × 512 KB | 25× | 0.9125 - 1.4125 | HD 6410D | 160:8:4 | 443 MHz | DDR3-1600 | 65 W | Sep 7, 2011 | AD33000OJZ22HX AD3300OJHXBOX |
| A4-3400 | 2.7 GHz | 27× | 600 MHz | AD3400OJZ22GX AD3400OJGXBOX |
||||||||||
| A6-3500 | B0 | 3 | 2.1 GHz | 2.4 GHz | 3 × 1 MB | 21-24× | 0.9125 - 1.4125 | HD 6530D | 320:16:8 | 443 MHz | DDR3-1866 | 65 W | Aug 17, 2011 | AD3500OJGXBOX |
| A6-3600 | B0 | 4 | 2.1 GHz | 2.4 GHz | 4 × 1 MB | 21-24× | 0.9125 - 1.4125 | HD 6530D | 320:16:8 | 443 MHz | DDR3-1866 | 65 W | Aug 17, 2011 | AD3600OJZ43GX AD3600OJGXBOX |
| A6-3650 | 2.6 GHz | 26× | 100 W | Jun 30, 2011 | AD3650WNZ43GX AD3650WNGXBOX |
|||||||||
| Athlon II X4 631 | B0 | 4 | 2.6 GHz | 4 × 1 MB | 26× | 0.9125 - 1.4125 | DDR3-1866 | 65 W 100 W |
Aug 17, 2011 | AD631XOJZ43GX AD631XWNZ43GX |
||||
| A8-3800 | B0 | 4 | 2.4 GHz | 2.7 GHz | 4 × 1 MB | 24-27× | 0.9125 - 1.4125 | HD 6550D | 400:20:8 | 600 MHz | DDR3-1866 | 65 W | Aug 17, 2011 | AD3800OJZ43GX AD3800OJGXBOX |
| A8-3850 | 2.9 GHz | 29× | 100 W | Jun 30, 2011 | AD3850WNZ43GX AD3850WNGXBOX |
|||||||||
| Athlon II X4 651 | B0 | 4 | 3.0 GHz | 4 × 1 MB | 30× | 0.9125 - 1.4125 | DDR3-1866 | 100 W | Nov 14, 2011 | AD651XWNZ43GX AD651XWNGXBOX |
Brazos
- Based on the Bobcat microarchitectureBobcat (processor)Bobcat is the latest x86 processor core from AMD aimed at low-power / low-cost market.It was revealed during a speech from AMD executive vice-president Henri Richard in Computex 2007 and was put into production Q1 2011. One of the major supporters was executive vice-president Mario A...
, all models are manufactured in TSMCTSMCTaiwan Semiconductor Manufacturing Company, Limited or TSMC is the world's largest dedicated independent semiconductor foundry, with its headquarters and main operations located in the Hsinchu Science Park in Hsinchu, Taiwan.-Overview:...
's 40 nm process in BGA-413 package for socketCPU socketA CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board . This allows the CPU to be replaced without soldering....
FT1. - All models support SSEStreaming SIMD ExtensionsIn computing, Streaming SIMD Extensions is a SIMD instruction set extension to the x86 architecture, designed by Intel and introduced in 1999 in their Pentium III series processors as a reply to AMD's 3DNow! . SSE contains 70 new instructions, most of which work on single precision floating point...
, SSE2SSE2SSE2, Streaming SIMD Extensions 2, is one of the Intel SIMD processor supplementary instruction sets first introduced by Intel with the initial version of the Pentium 4 in 2001. It extends the earlier SSE instruction set, and is intended to fully supplant MMX. Intel extended SSE2 to create SSE3...
, SSE3SSE3SSE3, Streaming SIMD Extensions 3, also known by its Intel code name Prescott New Instructions , is the third iteration of the SSE instruction set for the IA-32 architecture. Intel introduced SSE3 in early 2004 with the Prescott revision of their Pentium 4 CPU...
, SSSE3SSSE3Supplemental Streaming SIMD Extensions 3 is a SIMD instruction set created by Intel and is the fourth iteration of the SSE technology.- History :...
, SSE4a, NX bitNX bitThe NX bit, which stands for No eXecute, is a technology used in CPUs to segregate areas of memory for use by either storage of processor instructions or for storage of data, a feature normally only found in Harvard architecture processors...
, AMD64, PowerNow!PowerNow!PowerNow! is speed throttling and power saving technology of AMD's processors used in laptops. The CPU's clock speed and VCore are automatically decreased when the computer is under low load or idle, to save battery power, reduce heat and noise...
, AMD-V. - All models feature DirectX 11 integrated graphics with UVD 3.0.
"Ontario" (40 nm)
| Model | | Step. | | CPU | | GPU | | Memory | | TDP Thermal Design Power The thermal design power , sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat... | | Released | | Part Number | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Cores | Freq. | Turbo | L2 Cache | Multi1 | Vcore CPU core voltage The CPU core voltage is the power supply voltage supplied to the CPU , GPU, or other device containing a processing core... | Model | Config2 | Freq. | Turbo | ||||||
| C-30 | B0 | 1 | 1.2 GHz | rowspan="2" | 512 KB | 12× | 1.25 - 1.35 | HD 6250 | 80:8:4 | 276 MHz | rowspan="2" | DDR3-1066 | 9 W | Jan 4, 2011 | CMC30AFPB12GT |
| C-50 | 2 | 1.0 GHz | 2 × 512 KB | 10× | 1.05 - 1.35 | CMC50AFPB22GT | |||||||||
| C-60 | 2 | 1.0 GHz | 1.33 GHz | 2 × 512 KB | 10-13.3× | HD 6290 | 80:8:4 | 276 MHz | 400 MHz | DDR3-1333 | 9 W | Aug 22, 2011 |
"Zacate" (40 nm)
| Model | | Step. | | CPU | | GPU | | Memory | | TDP Thermal Design Power The thermal design power , sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat... | | Released | | Part Number | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Cores | Freq. | Turbo | L2 Cache | Multi1 | Vcore CPU core voltage The CPU core voltage is the power supply voltage supplied to the CPU , GPU, or other device containing a processing core... | Model | Config2 | Freq. | Turbo | ||||||
| E-240 | B0 | 1 | 1.5 GHz | rowspan="4" | 512 KB | 15× | 1.175 - 1.35 | HD 6310 | 80:8:4 | 500 MHz | DDR3-1066 | 18 W | Jan 4, 2011 | EME240GBB12GT | |
| E-300 | 2 | 1.3 GHz | 2 × 512 KB | 13× | HD 6310 | 80:8:4 | 488 MHz | rowspan="2" | DDR3-1333 | Aug 22, 2011 | |||||
| E-350 | B0 | 1.6 GHz | 16× | 1.25 - 1.35 | 492 MHz | DDR3-1066 | Jan 4, 2011 | EME350GBB22GT | |||||||
| E-450 | C0 | 2 | 1.65 GHz | 2 × 512 KB | 16.5× | HD 6320 | 80:8:4 | 508 MHz | 600 MHz | DDR3-1333 | Aug 22, 2011 |
"Desna" (40nm)
| Model | | Step. | | CPU | | GPU | | Memory | | TDP Thermal Design Power The thermal design power , sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat... | | Released | | Part Number | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Cores | Freq. | Turbo | L2 Cache | Multi1 | Vcore CPU core voltage The CPU core voltage is the power supply voltage supplied to the CPU , GPU, or other device containing a processing core... | Model | Config2 | Freq. | Turbo | ||||||
| Z-01 | B0 | 2 | 1.0 GHz | 2 × 512 KB | 10× | HD 6250 | 80:8:4 | 276 MHz | DDR3-1066 | 5.9 W | June 1, 2011 |
"Llano" (32 nm)
- All models feature upgraded Stars (AMD 10h architecture) codenamed Husky CPU cores (K10.5) with no L3 cache, and with Redwood-class integrated graphics on die (BeaverCreek for the dual-core variants and WinterPark for the quad-core variants).
- All models are manufactured on GlobalFoundriesGLOBALFOUNDRIESGlobalFoundries Inc. is the world's third largest independent semiconductor foundry, with its headquarters located in Milpitas, California. GlobalFoundries was created by the divestiture of the manufacturing side of AMD on March 2, 2009, and was expanded through its merger with Chartered...
' 32 nm SOI process for socketCPU socketA CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board . This allows the CPU to be replaced without soldering....
FS1. - All models have an integrated PCIe 2.0 controller.
- Select models support AMD's Turbo Core technology for faster CPU operation when the thermal specification permits.
- All models support 1.35 V DDR3L-1333 memory, in addition to regular 1.5 V DDR3 memory specified, with 2.5 GT/s UMIUMIUMI may refer to:* Universal Mobile Interface * Universal Metering Interface * Urban Ministries, Inc. * The former name of ProQuest, a microfilm and electronic archive...
. - All models support: SSEStreaming SIMD ExtensionsIn computing, Streaming SIMD Extensions is a SIMD instruction set extension to the x86 architecture, designed by Intel and introduced in 1999 in their Pentium III series processors as a reply to AMD's 3DNow! . SSE contains 70 new instructions, most of which work on single precision floating point...
, SSE2SSE2SSE2, Streaming SIMD Extensions 2, is one of the Intel SIMD processor supplementary instruction sets first introduced by Intel with the initial version of the Pentium 4 in 2001. It extends the earlier SSE instruction set, and is intended to fully supplant MMX. Intel extended SSE2 to create SSE3...
, SSE3SSE3SSE3, Streaming SIMD Extensions 3, also known by its Intel code name Prescott New Instructions , is the third iteration of the SSE instruction set for the IA-32 architecture. Intel introduced SSE3 in early 2004 with the Prescott revision of their Pentium 4 CPU...
, SSE4a, Enhanced 3DNow!3DNow!3DNow! is an extension to the x86 instruction set developed by Advanced Micro Devices . It adds single instruction multiple data instructions to the base x86 instruction set, enabling it to perform simple vector processing, which improves the performance of many graphic-intensive applications...
, NX bitNX bitThe NX bit, which stands for No eXecute, is a technology used in CPUs to segregate areas of memory for use by either storage of processor instructions or for storage of data, a feature normally only found in Harvard architecture processors...
, AMD64, PowerNow!PowerNow!PowerNow! is speed throttling and power saving technology of AMD's processors used in laptops. The CPU's clock speed and VCore are automatically decreased when the computer is under low load or idle, to save battery power, reduce heat and noise...
, AMD-V. - Transistors: 1.45 billion
- DieDie (integrated circuit)A die in the context of integrated circuits is a small block of semiconducting material, on which a given functional circuit is fabricated.Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon or other semiconductor through processes such as...
size: 228 mm²
| Model | | Step. | | CPU | | GPU | | Memory | | TDP Thermal Design Power The thermal design power , sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat... | | Released | | Part Number | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Cores | Freq. | Turbo | L2 Cache | Multi1 | Vcore CPU core voltage The CPU core voltage is the power supply voltage supplied to the CPU , GPU, or other device containing a processing core... | Model | Config2 | Freq. | Turbo | ||||||
| E2-3000M | B0 | 2 | 1.8 GHz | 2.4 GHz | 2 × 512 KB | 18-24× | 0.9125 - 1.4125 |
HD 6380G | 160:8:4 | 400 MHz | rowspan="3" | DDR3-1333 | 35 W | Jun 14, 2011 | EM3000DDX22GX |
| A4-3300M | 1.9 GHz | 2.5 GHz | 2 × 1 MB | 19-25× | HD 6480G | 240:12:4 | 444 MHz | 35 W | AM3300DDX23GX | ||||||
| A4-3310MX | 2.1 GHz | 21-25× | 45 W | AM3310HLX23GX | |||||||||||
| A6-3400M | B0 | 4 | 1.4 GHz | 2.3 GHz | 4 × 1 MB | 14-23× | 0.9125 - 1.4125 |
HD 6520G | 320:16:8 | 400 MHz | rowspan="5" | DDR3-1333 | 35 W | Jun 14, 2011 | AM3400DDX43GX |
| A6-3410MX | 1.6 GHz | 16-23× | DDR3-1600 | 45 W | AM3410HLX43GX | ||||||||||
| A8-3500M | 1.5 GHz | 2.4 GHz | 15-24× | HD 6620G | 400:20:8 | 444 MHz | DDR3-1333 | 35 W | AM3500DDX43GX | ||||||
| A8-3510MX | 1.8 GHz | 2.5 GHz | 18-25× | DDR3-1600 | 45 W | AM3510HLX43GX | |||||||||
| A8-3530MX | 1.9 GHz | 2.6 GHz | 19-26× | AM3530HLX43GX |
Brazos
- Based on the Bobcat microarchitectureBobcat (processor)Bobcat is the latest x86 processor core from AMD aimed at low-power / low-cost market.It was revealed during a speech from AMD executive vice-president Henri Richard in Computex 2007 and was put into production Q1 2011. One of the major supporters was executive vice-president Mario A...
. - All models support SSEStreaming SIMD ExtensionsIn computing, Streaming SIMD Extensions is a SIMD instruction set extension to the x86 architecture, designed by Intel and introduced in 1999 in their Pentium III series processors as a reply to AMD's 3DNow! . SSE contains 70 new instructions, most of which work on single precision floating point...
, SSE2SSE2SSE2, Streaming SIMD Extensions 2, is one of the Intel SIMD processor supplementary instruction sets first introduced by Intel with the initial version of the Pentium 4 in 2001. It extends the earlier SSE instruction set, and is intended to fully supplant MMX. Intel extended SSE2 to create SSE3...
, SSE3SSE3SSE3, Streaming SIMD Extensions 3, also known by its Intel code name Prescott New Instructions , is the third iteration of the SSE instruction set for the IA-32 architecture. Intel introduced SSE3 in early 2004 with the Prescott revision of their Pentium 4 CPU...
, SSSE3SSSE3Supplemental Streaming SIMD Extensions 3 is a SIMD instruction set created by Intel and is the fourth iteration of the SSE technology.- History :...
, SSE4a, NX bitNX bitThe NX bit, which stands for No eXecute, is a technology used in CPUs to segregate areas of memory for use by either storage of processor instructions or for storage of data, a feature normally only found in Harvard architecture processors...
, AMD64, PowerNow!PowerNow!PowerNow! is speed throttling and power saving technology of AMD's processors used in laptops. The CPU's clock speed and VCore are automatically decreased when the computer is under low load or idle, to save battery power, reduce heat and noise...
, AMD-V. - All models support up to 2 DIMMDIMMA DIMM or dual in-line memory module, comprises a series of dynamic random-access memory integrated circuits. These modules are mounted on a printed circuit board and designed for use in personal computers, workstations and servers...
s of DDR3-1333 or DDR3L-1066 single-channel memory, with 5 GT/s UMIUMIUMI may refer to:* Universal Mobile Interface * Universal Metering Interface * Urban Ministries, Inc. * The former name of ProQuest, a microfilm and electronic archive...
. - All models feature DirectX 11 integrated graphics with UVD 3.0.
- All models integrated in a FC-BGABGABGA can refer to:* Bach-Gesellschaft Ausgabe, the first complete edition of the works of J.S. Bach* Ball Grid Array, a type of surface-mount packaging used for integrated circuits* Battle Ground Academy, a private school in Franklin, Tennessee, USA...
package for the FT1(BGA-413) socketCPU socketA CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board . This allows the CPU to be replaced without soldering....
.
"Ontario" & "Zacate" (40 nm)
| Model Number | | Step. | | CPU | | GPU | | Memory Support | | TDP Thermal Design Power The thermal design power , sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat... | | Released | | Part Number | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Cores | Freq. | L2 Cache | Multi1 | Voltage CPU core voltage The CPU core voltage is the power supply voltage supplied to the CPU , GPU, or other device containing a processing core... | Model | Config2 | Freq. | ||||||
| G-Series T24L | B0 |
1 | 800 MHz 1.0 GHz |
512 KB | 8× 10× |
rowspan="3" colspan="3" | DDR3-1066 | 5 W | Mar 1, 2011 May 23, 2011 |
GET24LFPB12GTE GET24LFQB12GVE |
|||
| G-Series T30L | B0 |
1 | 1.4 GHz | 512 KB | 14× | 18 W | Mar 1, 2011 May 23, 2011 |
GET30LGBB12GTE GET30LGBB12GVE |
|||||
| G-Series T48L | B0 |
2 | 2 × 512 KB | Mar 1, 2011 May 23, 2011 |
GET48LGBB22GTE GET48LGBB22GVE |
||||||||
| G-Series T40R | 1 | 1.0 GHz | 512 KB | 10× | HD 6250 | 80:8:4 | 280 MHz | DDR3-1066 | 5.5 W | May 23, 2011 | GET40RFQB12GVE | ||
| G-Series T40E | 2 | 2 × 512 KB | 6.4 W | GET40EFQB22GVE | |||||||||
| G-Series T40N3 | B0 |
2 | 1.0 GHz | 2 × 512 KB | 10× | HD 6250 HD 6290 |
80:8:4 | 280 MHz 280 MHz3 |
DDR3-1066 | 9 W | Jan 19, 2011 May 23, 2011 |
GET40NFPB22GTE GET40NFPB22GVE |
|
| G-Series T44R | B0 |
1 | 1.2 GHz | 512 KB | 12× | HD 6250 | 280 MHz | Jan 19, 2011 May 23, 2011 |
GET44RFPB12GTE GET44RFPB12GVE |
||||
| G-Series T48N | B0 |
2 | 1.4 GHz | 2 × 512 KB | 14× | HD 6310 | 80:8:4 | 500 MHz 520 MHz |
DDR3-1066 | 18 W | Jan 19, 2011 May 23, 2011 |
GET48NGBB22GTE GET48NGBB22GVE |
|
| G-Series T52R | B0 |
1 | 1.5 GHz | 512 KB | 15× | 500 MHz | DDR3-1066 DDR3-1333 |
Jan 19, 2011 May 23, 2011 |
GET52RGBB12GTE GET52RGBB12GVE |
||||
| G-Series T56N3 | B0 |
2 | 1.6 GHz 1.65 GHz |
2 × 512 KB | 16× 16.5× |
HD 6310 HD 6320 |
80:8:4 | 500 MHz 500 MHz3 |
DDR3-1066 DDR3-1333 |
18 W | Jan 19, 2011 May 23, 2011 |
GET56NGBB22GTE GET56NGBB22GVE |
|
See also
- Comparison of FCH (Fusion Controller Hub)
