MIL-STD-883
Encyclopedia
The MIL-STD-883 standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace
electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations; mechanical and electrical tests; workmanship and training procedures; and such other controls and constraints as have been deemed necessary to ensure a uniform level of quality and reliability
suitable to the intended applications of those devices. For the purpose of this standard, the term "devices" includes such items as monolithic, multichip, film and hybrid microcircuits, microcircuit arrays, and the elements from which the circuits and arrays are formed. This standard is intended to apply only to microelectronic devices.
); Glassivation layer integrity; Wetting balance solderability; Nondestructive bond pull; Lid torque for glass-frit-sealed packages;
Adhesion of lead finish; Random vibration; Substrate attach strength; Pin grid package destructive lead pull test; Ceramic chip carrier bond strength; Ultrasonic inspection of die attach; Flip chip pull-off test; Visual inspection of passive elements; Ultrasonic inspection of TAB bonds; Resistance to soldering heat.
Static latch-up measurements for digital CMOS microelectronic devices; Simultaneous switching noise measurements for digital microelectronic devices.
Aerospace
Aerospace comprises the atmosphere of Earth and surrounding space. Typically the term is used to refer to the industry that researches, designs, manufactures, operates, and maintains vehicles moving through air and space...
electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations; mechanical and electrical tests; workmanship and training procedures; and such other controls and constraints as have been deemed necessary to ensure a uniform level of quality and reliability
Reliability (statistics)
In statistics, reliability is the consistency of a set of measurements or of a measuring instrument, often used to describe a test. Reliability is inversely related to random error.-Types:There are several general classes of reliability estimates:...
suitable to the intended applications of those devices. For the purpose of this standard, the term "devices" includes such items as monolithic, multichip, film and hybrid microcircuits, microcircuit arrays, and the elements from which the circuits and arrays are formed. This standard is intended to apply only to microelectronic devices.
Environmental tests, methods 1001-1034
Barometric pressure, reduced (altitude operation); Immersion; Insulation resistance; Moisture resistance; Steady state life; Intermittent life; Agree life; Stabilization bake; Salt atmosphere; Temperature cycling; Thermal shock; Thermal characteristics; Dew point; Seal; Burn-in test; Life/reliability characterization tests; Neutron irradiation; Internal gas analysis; Ionizing radiation (total dose) test procedure; Dose rate induced latchup test procedure; Dose rate upset testing of digital microcircuits; Mosfet threshold voltage; Dose rate response of linear microcircuits; Preseal burn-in; Thin film corrosion test; Package induced soft error test procedure; Endurance life test; Die penetrant testMechanical tests, methods 2001-2036
Constant acceleration; Mechanical shock; Solderability; Lead integrity; Vibration fatigue; Vibration noise; Vibration, variable frequency; Visual and mechanical; External visual; Internal visual (monolithic); Bond strength (bond pull test); Radiography; Internal visual inspection for DPA; Internal visual and mechanical; Resistance to solvents; Physical dimensions; Internal visual (hybrid); Scanning electron microscope (SEM) inspection of metallization; Die shear strength; Particle impact noise detection test (PINDPIND
A PIND test is a Particle Impact Noise Detection test.According to method 2020.8 of MIL-STD-883, the purpose of a PIND test is to detect loose particles inside an electronics device cavity. The test provides a nondestructive means of identifying those devices containing particles of sufficient mass...
); Glassivation layer integrity; Wetting balance solderability; Nondestructive bond pull; Lid torque for glass-frit-sealed packages;
Adhesion of lead finish; Random vibration; Substrate attach strength; Pin grid package destructive lead pull test; Ceramic chip carrier bond strength; Ultrasonic inspection of die attach; Flip chip pull-off test; Visual inspection of passive elements; Ultrasonic inspection of TAB bonds; Resistance to soldering heat.
Electrical tests (digital), methods 3001-3024
Drive source, dynamic; Load conditions; Delay measurements; Transition time measurements; Power supply current; High level output voltage; Low level output voltage; Breakdown voltage, input or output; Input current, low level; Input current, high level; Output short circuit current; Terminal capacitance; Noise margin measurements for digital microelectronic devices; Functional testing; Electrostatic discharge sensitivity classification; Activation time verification; Microelectronics package digital signal transmission; Crosstalk measurements for digital microelectronic device packages; Ground and power supply impedance measurements for digital microelectronics device packages; High impedance (off-state) low-level output leakage current; High impedance (off-state) high-level output leakage current; Input clamp voltage;Static latch-up measurements for digital CMOS microelectronic devices; Simultaneous switching noise measurements for digital microelectronic devices.