MicroLeadFrame
Encyclopedia
QFN
Flat no-leads packages such as QFN and DFN physically and electrically connect integrated circuits to printed circuit boards. Flat no-leads, also known as MicroLeadFrame, is a surface-mount technology, one of several package technologies that connect ICs to the surfaces of PCBs without...
- Quad Flat No-Lead package) is a near CSP
Chip scale package
A chip scale package is a type of integrated circuit chip carrier.Originally, CSP was the acronym for chip-size packaging. Since only a few packages are chip size, the meaning of the acronym was adapted to chip-scale packaging...
plastic encapsulated package with a copper leadframe substrate. This package uses perimeter lands on the bottom of the package to provide electrical contact to the (PWB
Printed circuit board
A printed circuit board, or PCB, is used to mechanically support and electrically connect electronic components using conductive pathways, tracks or signal traces etched from copper sheets laminated onto a non-conductive substrate. It is also referred to as printed wiring board or etched wiring...
- Printed Wiring Board). The package also offers Amkor's ExposedPad technology as a thermal enhancement by having the die attach paddle exposed on the bottom of the package surface to provide an efficient heat path when soldered directly to the PWB. This enhancement also enables stable ground by use of down bonds or by electrical connection through a conductive die attach material.
A more recent design variation which allows for higher density connections is the Dual Row MicroLeadFrame (DRMLF) package. This is an MLF package with 2 rows of lands for devices requiring up to 164 I/O. Typical applications include hard disk drives, USB controllers, and Wireless LAN.