Micro leadframe package (MLP) is a family of integrated circuit

Integrated circuit

An integrated circuit or monolithic integrated circuit is an electronic circuit manufactured by the patterned diffusion of trace elements into the surface of a thin substrate of semiconductor material...

 QFN

QFN

Flat no-leads packages such as QFN and DFN physically and electrically connect integrated circuits to printed circuit boards. Flat no-leads, also known as MicroLeadFrame, is a surface-mount technology, one of several package technologies that connect ICs to the surfaces of PCBs without...

 packages, used in surface mounted electronic

Electronics

Electronics is the branch of science, engineering and technology that deals with electrical circuits involving active electrical components such as vacuum tubes, transistors, diodes and integrated circuits, and associated passive interconnection technologies...

 circuits designs. It is available in 3 versions which are MLPQ (Q stands for quad), MLPM (M stands for micro), and MLPD (D stands for dual). These package generally have an exposed die attach pad to improve thermal performance. This package is similar to chip scale package

Chip scale package

A chip scale package is a type of integrated circuit chip carrier.Originally, CSP was the acronym for chip-size packaging. Since only a few packages are chip size, the meaning of the acronym was adapted to chip-scale packaging...

s (CSP) in construction. MLPD are designed to provide a footprint-compatible replacement for small-outline integrated circuit

Small-Outline Integrated Circuit

A small-outline integrated circuit is a surface-mounted integrated circuit package which occupies an area about 30–50% less than an equivalent DIP, with a typical thickness that is 70% less. They are generally available in the same pinouts as their counterpart DIP ICs...

(SOIC) packages.