Organic Solderability Preservative
Encyclopedia
Organic Solderability Preservative, or OSP is a method for plating
printed circuit board
s. It uses a water-based organic compound
that selectively bonds to copper and provides an organometallic layer that protects the copper
during soldering
.
Plating
Plating is a surface covering in which a metal is deposited on a conductive surface. Plating has been done for hundreds of years, but it is also critical for modern technology...
printed circuit board
Printed circuit board
A printed circuit board, or PCB, is used to mechanically support and electrically connect electronic components using conductive pathways, tracks or signal traces etched from copper sheets laminated onto a non-conductive substrate. It is also referred to as printed wiring board or etched wiring...
s. It uses a water-based organic compound
Organic compound
An organic compound is any member of a large class of gaseous, liquid, or solid chemical compounds whose molecules contain carbon. For historical reasons discussed below, a few types of carbon-containing compounds such as carbides, carbonates, simple oxides of carbon, and cyanides, as well as the...
that selectively bonds to copper and provides an organometallic layer that protects the copper
Copper
Copper is a chemical element with the symbol Cu and atomic number 29. It is a ductile metal with very high thermal and electrical conductivity. Pure copper is soft and malleable; an exposed surface has a reddish-orange tarnish...
during soldering
Soldering
Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint, the filler metal having a lower melting point than the workpiece...
.