Quilt packaging
Encyclopedia
Quilt Packaging is an electronic packaging
technology under research that allows microchip
s made of dissimilar materials to be attached like squares in a quilt
. Chips are connected in a way that minimizes both thermal stress and interchip delay times. The reflection coefficient s11 has been measured at less than -25dB at 40GHz in high resistivity silicon. Connections between microchips are made by thin metal lines which extend over the edge of each chip.
The current process involves the etching and deposition of silicon dioxide
, evaporating and electroplating of thick copper bumps, Chemical-mechanical planarization
of the copper, and the Advanced Silicon Etch
process to separate into individual chips with undercut metal nodules extending off the edges. The nodules can be joined together using ordinary lead-free soldering.
Electronic packaging
Electronic packaging is a major discipline within the field of electronic engineering, and includes a wide variety of technologies. It refers to enclosures and protective features built into the product itself, and not to shipping containers...
technology under research that allows microchip
Integrated circuit
An integrated circuit or monolithic integrated circuit is an electronic circuit manufactured by the patterned diffusion of trace elements into the surface of a thin substrate of semiconductor material...
s made of dissimilar materials to be attached like squares in a quilt
Quilt
A quilt is a type of bed cover, traditionally composed of three layers of fiber: a woven cloth top, a layer of batting or wadding and a woven back, combined using the technique of quilting. “Quilting” refers to the technique of joining at least two fabric layers by stitches or ties...
. Chips are connected in a way that minimizes both thermal stress and interchip delay times. The reflection coefficient s11 has been measured at less than -25dB at 40GHz in high resistivity silicon. Connections between microchips are made by thin metal lines which extend over the edge of each chip.
The current process involves the etching and deposition of silicon dioxide
Silicon dioxide
The chemical compound silicon dioxide, also known as silica , is an oxide of silicon with the chemical formula '. It has been known for its hardness since antiquity...
, evaporating and electroplating of thick copper bumps, Chemical-mechanical planarization
Chemical-mechanical planarization
Chemical Mechanical Polishing/Planarization is a process of smoothing surfaces with the combination of chemical and mechanical forces. It can be thought of as a hybrid of chemical etching and free abrasive polishing.-Description:...
of the copper, and the Advanced Silicon Etch
Advanced Silicon Etch
Advanced Silicon Etch is a deep reactive ion etching technique to rapidly etch deep and high aspect ratio structures in silicon.ASE was pioneered by Surface Technology Systems Plc. in 1994 in the UK...
process to separate into individual chips with undercut metal nodules extending off the edges. The nodules can be joined together using ordinary lead-free soldering.