TQFP
Encyclopedia
A thin quad flat pack is a type of surface-mounted
package
. TQFPs provide the same benefits of the metric QFP
, but are thinner (body thickness of 1.0 mm) and have a standard lead-frame footprint (2.0 mm lead footprint).
TQFPs help solve issues such as increasing board density, die shrink programs, thin end-product profile and portability. Lead counts range from 32 to 176. Body sizes range from 5 mm x 5 mm to 20 x 20 mm. Copper lead-frames are used in TQFPs. Lead pitches available for TQFPs are 0.4 mm, 0.5 mm, 0.65 mm, 0.8 mm, and 1.0mm.
Surface-mount technology
Surface mount technology is a method for constructing electronic circuits in which the components are mounted directly onto the surface of printed circuit boards . An electronic device so made is called a surface mount device...
package
Chip carrier
A chip carrier, also known as a chip container or chip package, is a container for a transistor or an integrated circuit. The carrier usually provides metal leads, or "pins", which are sturdy enough to electrically and mechanically connect the fragile chip to a circuit board. This connection may be...
. TQFPs provide the same benefits of the metric QFP
QFP
A QFP or Quad Flat Package is a surface mount integrated circuit package with leads extending from each of the four sides. Socketing such packages is rare and hole mounting is not possible. Versions ranging from 32 to 304 pins with a pitch ranging from 0.4 to 1.0 mm are common...
, but are thinner (body thickness of 1.0 mm) and have a standard lead-frame footprint (2.0 mm lead footprint).
TQFPs help solve issues such as increasing board density, die shrink programs, thin end-product profile and portability. Lead counts range from 32 to 176. Body sizes range from 5 mm x 5 mm to 20 x 20 mm. Copper lead-frames are used in TQFPs. Lead pitches available for TQFPs are 0.4 mm, 0.5 mm, 0.65 mm, 0.8 mm, and 1.0mm.