Thin small-outline package
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Ic
IC, ic, or i.c. may stand for:In computing and technology:* .ic.gov, a second-level domain name administered by the US Government for members of the intelligence community* Integrated circuit* Initial condition...
package. They are notably very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm).
They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume. In some applications, they are being supplanted by ball grid array
Ball grid array
A ball grid array is a type of surface-mount packaging used for integrated circuits.- Description :The BGA is descended from the pin grid array , which is a package with one face covered with pins in a grid pattern. These pins conduct electrical signals from the integrated circuit to the printed...
packages which can achieve even higher densities. The prime application for this technology is memory. SRAM
Static random access memory
Static random-access memory is a type of semiconductor memory where the word static indicates that, unlike dynamic RAM , it does not need to be periodically refreshed, as SRAM uses bistable latching circuitry to store each bit...
, Flash memory
Flash memory
Flash memory is a non-volatile computer storage chip that can be electrically erased and reprogrammed. It was developed from EEPROM and must be erased in fairly large blocks before these can be rewritten with new data...
, FSRAM and E2PROM find this package symbiotic with end-use products. It answers the needs required by telecom, cellular, memory modules, PC Card
PC Card
In computing, PC Card is the form factor of a peripheral interface designed for laptop computers. The PC Card standard was defined and developed by the Personal Computer Memory Card International Association which itself was created by a number of computer industry companies in the United States...
s (PCMCIA cards), wireless, netbooks and countless other product applications.
TSOP is the smallest leaded form factor for flash memory.
Physical properties
TSOPs are rectangular in shape and come in two varieties: Type I and Type II. Type I ICs have the pins on the shorter side and Type II have the pins on the longer side. The table below shows basic measurements for common TSOP packages.Type I
| Part Number | Pins | Body Width/mm | Body Length/mm | Lead Pitch/mm |
|---|---|---|---|---|
| TSOP28 | 28 | 8.1 | 11.8 | 0.55 |
| TSOP28/32 | 28/32 | 8 | 18.4 | 0.5 |
| TSOP40 | 40 | 10 | 18.4 | 0.5 |
| TSOP48 | 48 | 12 | 18.4 | 0.5 |
| TSOP56 | 56 | 14 | 18.4 | 0.5 |
Type II
| Part Number | Pins | Body Width/mm | Body Length/mm | Lead Pitch/mm |
|---|---|---|---|---|
| TSOP20/24/26 | 20/24/26 | 7.6 | 17.14 | 1.27 |
| TSOP24/28 | 24/28 | 10.16 | 18.41 | 1.27 |
| TSOP32 | 32 | 10.16 | 20.95 | 1.27 |
| TSOP40/44 | 40/44 | 10.16 | 18.42 | 0.8 |
| TSOP50 | 50 | 10.16 | 20.95 | 0.8 |
| TSOP54 | 54 | 10.16 | 22.22 | 0.8 |
| TSOP66 | 66 | 10.16 | 22.22 | 0.65 |
Similar packages
There are a variety of small form-factor IC carrier available other than TSOPs- Small-outline integrated circuitSmall-Outline Integrated CircuitA small-outline integrated circuit is a surface-mounted integrated circuit package which occupies an area about 30–50% less than an equivalent DIP, with a typical thickness that is 70% less. They are generally available in the same pinouts as their counterpart DIP ICs...
(SOIC) - Plastic small-outline package (PSOP)
- Shrink small-outline packageShrink Small-Outline PackageShrink small-outline package is a microchip package for surface-mount technology. SSOP chips have "gull wing" leads protruding from the two long sides, and a lead spacing of 0.025 inches ....
(SSOP) - Thin-shrink small outline packageTSSOPA TSSOP is a rectangular, thin body size surface mount component. A Type I TSSOP has legs protruding from the width portion of the package. A Type II TSSOP has the legs protruding from the length portion of the package...
(TSSOP)