Copper-based chips
Encyclopedia
Copper-based chips are semiconductor
integrated circuit
s, usually microprocessor
s, which use copper
for interconnections. Since copper is a better conductor than aluminium
, chips using this technology can have smaller metal components, and use less energy to pass electricity through them. Together, these effects lead to higher-performance processors.
The transition from aluminium to copper required significant developments in fabrication techniques, including radically different methods for patterning the metal as well as the introduction of barrier metal layers to isolate the silicon from potentially damaging copper atoms.
and plasma etching
that had been used with great success with aluminium. The inability to plasma etch copper called for a drastic rethinking of the metal patterning process and the result of this rethinking was a process referred to as an additive patterning or a "Damascene"
or "dual-Damascene" process.
In this process, the underlying silicon oxide insulating layer is patterned with open trenches where the conductor should be. A thick coating of copper that significantly overfills the trenches is deposited on the insulator, and chemical-mechanical planarization
(CMP; also called chemical-mechanical polishing) is used to remove the copper to the level of the top of the insulating layer. Copper sunken within the trenches of the insulating layer is not removed and becomes the patterned conductor. Damascene processes generally form and fill a single feature with copper per Damascene stage. Dual-Damascene processes generally form and fill two features with copper at once, e.g., a trench overlying a via
may both be filled with a single copper deposition using dual-Damascene.
With successive layers of insulator and copper, a multilayer (5-10 metal layers or more) interconnection structure is created. Without the ability of CMP to remove the copper coating in a planar and uniform fashion, and without the ability of the CMP process to stop repeatably at the copper-insulator interface, this technology would not be realizable.
layer must completely surround all copper interconnections, since diffusion
of copper into surrounding materials would degrade their properties. For instance, silicon
forms deep-level trap
s when doped
with copper. As the name implies, a barrier metal must limit copper diffusivity sufficiently to chemically isolate the copper conductor from the silicon below, yet have high electrical conductivity in order to maintain a good electronic contact.
The thickness of the barrier film is also quite important; with too thin a layer, the copper contacts poison the very devices that they connect to; with too thick a layer, the stack of two barrier metal films and a copper conductor have a greater total resistance than aluminium interconnects, eliminating any benefit.
The improvement in conductivity in going from earlier aluminium to copper based conductors was modest, and not as good as to be expected by a simple comparison of bulk conductivities of aluminium and copper. The addition of barrier metals on all four sides of the copper conductor significantly reduces the cross-sectional area of the conductor that is composed of pure, low resistance, copper. Aluminium, while requiring a thin barrier metal to promote low ohmic resistance when making a contact directly to silicon or aluminium layers, did not require barrier metals on the sides of the metal lines to isolate aluminium from the surrounding silicon oxide insulators.
, the process by which a metal conductor changes shape under the influence of an electric current flowing through it and which eventually leads to the breaking of the conductor, is significantly better with copper than with aluminium. This improvement in electromigration resistance allows higher currents to flow through a given size copper conductor compared to aluminium. The combination of a modest increase in conductivity along with this improvement in electromigration resistance was to prove highly attractive. The overall benefits derived from these performance improvements were ultimately enough to drive full-scale investment in copper-based technologies and fabrication methods for high performance semiconductor devices, and copper-based processes continue to be the state of the art for the semiconductor industry today.
Semiconductor
A semiconductor is a material with electrical conductivity due to electron flow intermediate in magnitude between that of a conductor and an insulator. This means a conductivity roughly in the range of 103 to 10−8 siemens per centimeter...
integrated circuit
Integrated circuit
An integrated circuit or monolithic integrated circuit is an electronic circuit manufactured by the patterned diffusion of trace elements into the surface of a thin substrate of semiconductor material...
s, usually microprocessor
Microprocessor
A microprocessor incorporates the functions of a computer's central processing unit on a single integrated circuit, or at most a few integrated circuits. It is a multipurpose, programmable device that accepts digital data as input, processes it according to instructions stored in its memory, and...
s, which use copper
Copper
Copper is a chemical element with the symbol Cu and atomic number 29. It is a ductile metal with very high thermal and electrical conductivity. Pure copper is soft and malleable; an exposed surface has a reddish-orange tarnish...
for interconnections. Since copper is a better conductor than aluminium
Aluminium
Aluminium or aluminum is a silvery white member of the boron group of chemical elements. It has the symbol Al, and its atomic number is 13. It is not soluble in water under normal circumstances....
, chips using this technology can have smaller metal components, and use less energy to pass electricity through them. Together, these effects lead to higher-performance processors.
The transition from aluminium to copper required significant developments in fabrication techniques, including radically different methods for patterning the metal as well as the introduction of barrier metal layers to isolate the silicon from potentially damaging copper atoms.
Patterning
Because of the lack of volatile copper compounds, copper could not be patterned by the previous techniques of photoresist maskingPhotolithography
Photolithography is a process used in microfabrication to selectively remove parts of a thin film or the bulk of a substrate. It uses light to transfer a geometric pattern from a photomask to a light-sensitive chemical "photoresist", or simply "resist," on the substrate...
and plasma etching
Plasma etching
Plasma etching is a form of plasma processing used to fabricate integrated circuits. It involves a high-speed stream of glow discharge of an appropriate gas mixture being shot at a sample. The plasma source, known as etch species, can be either charged or neutral...
that had been used with great success with aluminium. The inability to plasma etch copper called for a drastic rethinking of the metal patterning process and the result of this rethinking was a process referred to as an additive patterning or a "Damascene"
Damascening
Damascening is the art of inlaying different metals into one another—typically, gold or silver into a darkly oxidized steel background—to produce intricate patterns similar to niello...
or "dual-Damascene" process.
In this process, the underlying silicon oxide insulating layer is patterned with open trenches where the conductor should be. A thick coating of copper that significantly overfills the trenches is deposited on the insulator, and chemical-mechanical planarization
Chemical-mechanical planarization
Chemical Mechanical Polishing/Planarization is a process of smoothing surfaces with the combination of chemical and mechanical forces. It can be thought of as a hybrid of chemical etching and free abrasive polishing.-Description:...
(CMP; also called chemical-mechanical polishing) is used to remove the copper to the level of the top of the insulating layer. Copper sunken within the trenches of the insulating layer is not removed and becomes the patterned conductor. Damascene processes generally form and fill a single feature with copper per Damascene stage. Dual-Damascene processes generally form and fill two features with copper at once, e.g., a trench overlying a via
Via (electronics)
A via is a vertical electrical connection between different layers of conductors in a physical electronic circuit.- In IC :In integrated circuit design, a via is a small opening in an insulating oxide layer that allows a conductive connection between different layers. A via on an integrated circuit...
may both be filled with a single copper deposition using dual-Damascene.
With successive layers of insulator and copper, a multilayer (5-10 metal layers or more) interconnection structure is created. Without the ability of CMP to remove the copper coating in a planar and uniform fashion, and without the ability of the CMP process to stop repeatably at the copper-insulator interface, this technology would not be realizable.
Barrier metal
A barrier metalBarrier metal
A barrier metal is a material used in integrated circuits to chemically isolate semiconductors from soft metal interconnects, while maintaining an electrical connection between them...
layer must completely surround all copper interconnections, since diffusion
Diffusion
Molecular diffusion, often called simply diffusion, is the thermal motion of all particles at temperatures above absolute zero. The rate of this movement is a function of temperature, viscosity of the fluid and the size of the particles...
of copper into surrounding materials would degrade their properties. For instance, silicon
Silicon
Silicon is a chemical element with the symbol Si and atomic number 14. A tetravalent metalloid, it is less reactive than its chemical analog carbon, the nonmetal directly above it in the periodic table, but more reactive than germanium, the metalloid directly below it in the table...
forms deep-level trap
Deep-level trap
Deep-level traps or deep-level defects are a generally undesirable type of electronic defect in semiconductors. They are "deep" in the sense that the energy required to remove an electron or hole from the trap to the valence or conduction band is much larger than the characteristic thermal energy...
s when doped
Doping (semiconductor)
In semiconductor production, doping intentionally introduces impurities into an extremely pure semiconductor for the purpose of modulating its electrical properties. The impurities are dependent upon the type of semiconductor. Lightly and moderately doped semiconductors are referred to as extrinsic...
with copper. As the name implies, a barrier metal must limit copper diffusivity sufficiently to chemically isolate the copper conductor from the silicon below, yet have high electrical conductivity in order to maintain a good electronic contact.
The thickness of the barrier film is also quite important; with too thin a layer, the copper contacts poison the very devices that they connect to; with too thick a layer, the stack of two barrier metal films and a copper conductor have a greater total resistance than aluminium interconnects, eliminating any benefit.
The improvement in conductivity in going from earlier aluminium to copper based conductors was modest, and not as good as to be expected by a simple comparison of bulk conductivities of aluminium and copper. The addition of barrier metals on all four sides of the copper conductor significantly reduces the cross-sectional area of the conductor that is composed of pure, low resistance, copper. Aluminium, while requiring a thin barrier metal to promote low ohmic resistance when making a contact directly to silicon or aluminium layers, did not require barrier metals on the sides of the metal lines to isolate aluminium from the surrounding silicon oxide insulators.
Electromigration
Resistance to electromigrationElectromigration
Electromigration is the transport of material caused by the gradual movement of the ions in a conductor due to the momentum transfer between conducting electrons and diffusing metal atoms. The effect is important in applications where high direct current densities are used, such as in...
, the process by which a metal conductor changes shape under the influence of an electric current flowing through it and which eventually leads to the breaking of the conductor, is significantly better with copper than with aluminium. This improvement in electromigration resistance allows higher currents to flow through a given size copper conductor compared to aluminium. The combination of a modest increase in conductivity along with this improvement in electromigration resistance was to prove highly attractive. The overall benefits derived from these performance improvements were ultimately enough to drive full-scale investment in copper-based technologies and fabrication methods for high performance semiconductor devices, and copper-based processes continue to be the state of the art for the semiconductor industry today.