EV Group
Encyclopedia
EV Group is a supplier of wafer processing solutions for the semiconductor
, MEMS and nanotechnology
industry. Key products include manual and fully automated lithography systems, wafer bonders and metrology equipment which can be used both for R&D and high volume production. The equipment is manufactured at the company’s headquarters located in St. Florian am Inn (Austria
). But EV Group is not only an equipment supplier, the company also offers process support and development.
In 1985, EVG developed the first double-side mask aligner with bottom side microscopes for the commercialization of MEMS products (microelectromechanical systems
). In 1990, EVG introduced the process concept of separation between wafer alignment and bonding, which has since become a worldwide industry standard. The introduction of the first production wafer bonding system for volume MEMS production in 1992 laid the foundation for the company’s wafer bonder business. In 1994, EVG installed the first SOI Production Bonders for volume production of high-quality SOI
(Silicon on insulator
) wafers. In 1999, EVG developed the patented SmartView wafer alignment system, which incorporates a revolutionary face-to-face alignment technology for Wafer-level Packaging
technologies and 3D interconnects. As early as 2001 EVG developed the first temporary bonding and debonding systems as a key enabling technology for 3D integration with TSV
(through-silicon via
) technology. The world's first fully automated production wafer bonding system for 300 mm wafers was launched by EVG in 2007, paving the way for the commercialization of 3D integration. EVG’s next-generation UV-NIL Step & Repeat (NIL = Nanoimprint lithography
) system, first installed in 2009, supports a new approach in wafer-level optics
/ micro-lens mastering. Also in 2009, EVG launched the first fully automated production fusion bonding system with optical alignment for back-side illuminated CMOS image sensors and 3D-IC.
Von Trapp, Francoise: EV Group: "Triple I" at Work; www.semineedle.com
Semiconductor
A semiconductor is a material with electrical conductivity due to electron flow intermediate in magnitude between that of a conductor and an insulator. This means a conductivity roughly in the range of 103 to 10−8 siemens per centimeter...
, MEMS and nanotechnology
Nanotechnology
Nanotechnology is the study of manipulating matter on an atomic and molecular scale. Generally, nanotechnology deals with developing materials, devices, or other structures possessing at least one dimension sized from 1 to 100 nanometres...
industry. Key products include manual and fully automated lithography systems, wafer bonders and metrology equipment which can be used both for R&D and high volume production. The equipment is manufactured at the company’s headquarters located in St. Florian am Inn (Austria
Austria
Austria , officially the Republic of Austria , is a landlocked country of roughly 8.4 million people in Central Europe. It is bordered by the Czech Republic and Germany to the north, Slovakia and Hungary to the east, Slovenia and Italy to the south, and Switzerland and Liechtenstein to the...
). But EV Group is not only an equipment supplier, the company also offers process support and development.
History
The company, originally known under the name of Electronic Visions Co., was founded by Erich Thallner (now EVG’s president) and Aya Maria Thallner in 1980. EVG operates via a global sales and customer support network with subsidiaries in the US, Japan, South Korea and Taiwan and employs approximately 450 employees worldwide.In 1985, EVG developed the first double-side mask aligner with bottom side microscopes for the commercialization of MEMS products (microelectromechanical systems
Microelectromechanical systems
Microelectromechanical systems is the technology of very small mechanical devices driven by electricity; it merges at the nano-scale into nanoelectromechanical systems and nanotechnology...
). In 1990, EVG introduced the process concept of separation between wafer alignment and bonding, which has since become a worldwide industry standard. The introduction of the first production wafer bonding system for volume MEMS production in 1992 laid the foundation for the company’s wafer bonder business. In 1994, EVG installed the first SOI Production Bonders for volume production of high-quality SOI
Silicon on insulator
Silicon on insulator technology refers to the use of a layered silicon-insulator-silicon substrate in place of conventional silicon substrates in semiconductor manufacturing, especially microelectronics, to reduce parasitic device capacitance and thereby improving performance...
(Silicon on insulator
Silicon on insulator
Silicon on insulator technology refers to the use of a layered silicon-insulator-silicon substrate in place of conventional silicon substrates in semiconductor manufacturing, especially microelectronics, to reduce parasitic device capacitance and thereby improving performance...
) wafers. In 1999, EVG developed the patented SmartView wafer alignment system, which incorporates a revolutionary face-to-face alignment technology for Wafer-level Packaging
Wafer-level Packaging
Wafer-level packaging is the technology of packaging an integrated circuit at wafer level. WLP is essentially a true chip scale package technology, since the resulting package is practically of the same size as the die....
technologies and 3D interconnects. As early as 2001 EVG developed the first temporary bonding and debonding systems as a key enabling technology for 3D integration with TSV
Through-silicon via
In electronic engineering, a through-silicon via is a vertical electrical connection passing completely through a silicon wafer or die...
(through-silicon via
Through-silicon via
In electronic engineering, a through-silicon via is a vertical electrical connection passing completely through a silicon wafer or die...
) technology. The world's first fully automated production wafer bonding system for 300 mm wafers was launched by EVG in 2007, paving the way for the commercialization of 3D integration. EVG’s next-generation UV-NIL Step & Repeat (NIL = Nanoimprint lithography
Nanoimprint Lithography
Nanoimprint lithography is a method of fabricating nanometer scale patterns. It is a simple nanolithography process with low cost, high throughput and high resolution. It creates patterns by mechanical deformation of imprint resist and subsequent processes. The imprint resist is typically a monomer...
) system, first installed in 2009, supports a new approach in wafer-level optics
Wafer-level optics
Wafer-level optics enables the design and manufacture of miniaturized optics at the wafer level using advanced semiconductor-like techniques...
/ micro-lens mastering. Also in 2009, EVG launched the first fully automated production fusion bonding system with optical alignment for back-side illuminated CMOS image sensors and 3D-IC.
Markets
EVG meets the varied demands of diverse markets. The company holds the dominant share of the market for wafer bonding equipment (especially SOI bonding) and is a leader in lithography for advanced packaging and nanotechnology.- Advanced Packaging, 3D Interconnect: Wafer level packaging employs specific alignment and wafer bonding techniques as an enabling solution for stacking of wafers and three-dimensional integration of devices.
- MEMS (MicroElectroMechanical SystemsMicroelectromechanical systemsMicroelectromechanical systems is the technology of very small mechanical devices driven by electricity; it merges at the nano-scale into nanoelectromechanical systems and nanotechnology...
): Micro-Electro-Mechanical Systems (MEMS) is the integration of mechanical elements, sensors, actuators, and electronics on a common silicon substrate through microfabrication technology. - SOI (Silicon-On-Insulator): SOI (Silicon-on-Insulator) is a semiconductor technology, which enables a full isolation of each electronic component on an integrated circuit by using a buried oxide layer.
- Compound SemiconductorCompound semiconductorA compound semiconductor is a semiconductor compound composed of elements from two or more different groups of the periodic table . These semiconductors typically form in groups 13-16 ,...
and Silicon based Power Devices: Microelectronic applications fabricated out of compound semiconductors as well as silicon-based power devices basically require dedicated manufacturing technologies offered by EVG. - NanotechnologyNanotechnologyNanotechnology is the study of manipulating matter on an atomic and molecular scale. Generally, nanotechnology deals with developing materials, devices, or other structures possessing at least one dimension sized from 1 to 100 nanometres...
: Nanotechnology refers to a field of applied science and technology whose theme is the control of matter on the atomic and molecular scale, generally 100 nanometers or smaller, and the fabrication of devices or materials that lie within that size range.
Solutions
EV Group offers a complete portfolio of wafer-level manufacturing solutions for various micro- and nanotechnology applications and products, addressing established as well as emerging markets. Selected manufacturing solutions are:- CMOS Image Sensors
- High Brightness LEDsLEDSLEDS can be initials for:* Law Enforcement Data System* Link Eleven Display System* Low Energy Dislocation Structure* Land Electronic Defence System * LEDs * Life-Events and Difficulties Schedule...
- Lab-on-ChipLab-on-a-chipA lab-on-a-chip is a device that integrates one or several laboratory functions on a single chip of only millimeters to a few square centimeters in size. LOCs deal with the handling of extremely small fluid volumes down to less than pico liters. Lab-on-a-chip devices are a subset of MEMS devices...
- Logic/Memory
- MEMS devices
- SAW devices
- SOISilicon on insulatorSilicon on insulator technology refers to the use of a layered silicon-insulator-silicon substrate in place of conventional silicon substrates in semiconductor manufacturing, especially microelectronics, to reduce parasitic device capacitance and thereby improving performance...
wafers - Wafer Level OpticsWafer-level opticsWafer-level optics enables the design and manufacture of miniaturized optics at the wafer level using advanced semiconductor-like techniques...
Memberships
- MEMS Industry Group
- Austrian Society for Microsystemtechnology
- Optical Society of AmericaOptical Society of AmericaThe Optical Society is a scientific society dedicated to advancing the study of light—optics and photonics—in theory and application, by means of publishing, organizing conferences and exhibitions, partnership with industry, and education. The organization has members in more than 100 countries...
- SEMI
- NILCom
- EMC3D
- MANCEF
External links
EV GroupVon Trapp, Francoise: EV Group: "Triple I" at Work; www.semineedle.com