Substrate coupling
Encyclopedia
In an integrated circuit
, a signal can couple from one node to another via the substrate. This phenomenon is referred to as substrate coupling or substrate noise coupling.
The push for reduced cost, more compact circuit boards, and added customer features has provided
incentives for the inclusion of analog
functions on primarily digital MOS integrated circuit
s (ICs) forming
mixed-signal IC
s. In these systems, the speed of digital circuits is constantly increasing, chips are
becoming more densely packed, interconnect layers are added, and analog resolution is increased. In addition, recent increase in wireless applications and its growing market are introducing a new set of aggressive design goals for realizing mixed-signal systems.
Here, the designer integrates radio frequency
(RF) analog and base band digital circuitry on a single chip.
The goal is to make single-chip radio frequency
integrated circuits (RFICs) on silicon, where all the blocks are fabricated on the same chip.
One of the advantages of this integration is low power dissipation for portability due to a reduction in the number of package pins and associated bond wire capacitance.
Another reason that an integrated solution offers lower power consumption is that routing high-frequency signals off-chip often requires a 50Ω impedance match
, which can result in higher power dissipation.
Other advantages include improved high-frequency performance due to reduced package interconnect parasitics, higher system reliability, smaller package count, smaller package interconnect parasitics, and higher integration of RF components with VLSI-compatible digital circuits.
In fact, the single-chip transceiver is now a reality.
The design of such systems, however, is a complicated task
. There are two main challenges in realizing
mixed-signal ICs. The first challenging task, specific to RFICs, is to fabricate good on-chip passive elements
such as high-Q inductor
s. The second challenging task, applicable to any mixed-signal IC and the subject
of this chapter, is to minimize noise coupling between various parts of the system to avoid any malfunctioning
of the system.
In other words, for successful system-on-chip integration of mixed-signal systems, the
noise coupling caused by nonideal isolation must be minimized so that sensitive analog
circuits and noisy digital circuits can effectively coexist, and the system operates correctly.
To elaborate, note that in mixed-signal
circuits, both sensitive analog circuits and high-swing high-frequency noise injector digital circuits may be
present on the same chip, leading to undesired signal coupling between these two types of circuit via the conductive substrate.
The reduced distance between these circuits, which is the result of constant technology scaling (see Moore's law
and the International Technology Roadmap for Semiconductors
),
exacerbates the coupling.
The problem is severe, since signals of different nature and strength interfere,
thus affecting the overall performance, which demands higher clock rates and greater analog
precisions.
The primary mixed-signal noise coupling problem comes from fast-changing digital signals
coupling to sensitive analog nodes.
Another significant cause of undesired signal
coupling is the Crosstalk (electronics)
between analog nodes themselves owing to
high-frequency/high-power analog
signals.
One of the media through which mixed-signal noise coupling occurs is the substrate.
Digital operations cause fluctuations in the underlying substrate voltage, which spreads
through the common substrate causing variations in the substrate potential of sensitive
devices in the analog section.
Similarly, in the case of crosstalk between analog nodes, a signal can couple from one
node to another via the substrate.
This phenomenon is referred to as substrate coupling or substrate noise coupling.
Integrated circuit
An integrated circuit or monolithic integrated circuit is an electronic circuit manufactured by the patterned diffusion of trace elements into the surface of a thin substrate of semiconductor material...
, a signal can couple from one node to another via the substrate. This phenomenon is referred to as substrate coupling or substrate noise coupling.
The push for reduced cost, more compact circuit boards, and added customer features has provided
incentives for the inclusion of analog
Analogue electronics
Analogue electronics are electronic systems with a continuously variable signal, in contrast to digital electronics where signals usually take only two different levels. The term "analogue" describes the proportional relationship between a signal and a voltage or current that represents the signal...
functions on primarily digital MOS integrated circuit
Integrated circuit
An integrated circuit or monolithic integrated circuit is an electronic circuit manufactured by the patterned diffusion of trace elements into the surface of a thin substrate of semiconductor material...
s (ICs) forming
mixed-signal IC
Mixed-signal integrated circuit
A mixed-signal integrated circuit is any integrated circuit that has both analog circuits and digital circuits on a single semiconductor die.- Examples :...
s. In these systems, the speed of digital circuits is constantly increasing, chips are
becoming more densely packed, interconnect layers are added, and analog resolution is increased. In addition, recent increase in wireless applications and its growing market are introducing a new set of aggressive design goals for realizing mixed-signal systems.
Here, the designer integrates radio frequency
Radio frequency
Radio frequency is a rate of oscillation in the range of about 3 kHz to 300 GHz, which corresponds to the frequency of radio waves, and the alternating currents which carry radio signals...
(RF) analog and base band digital circuitry on a single chip.
The goal is to make single-chip radio frequency
integrated circuits (RFICs) on silicon, where all the blocks are fabricated on the same chip.
One of the advantages of this integration is low power dissipation for portability due to a reduction in the number of package pins and associated bond wire capacitance.
Another reason that an integrated solution offers lower power consumption is that routing high-frequency signals off-chip often requires a 50Ω impedance match
Impedance matching
In electronics, impedance matching is the practice of designing the input impedance of an electrical load to maximize the power transfer and/or minimize reflections from the load....
, which can result in higher power dissipation.
Other advantages include improved high-frequency performance due to reduced package interconnect parasitics, higher system reliability, smaller package count, smaller package interconnect parasitics, and higher integration of RF components with VLSI-compatible digital circuits.
In fact, the single-chip transceiver is now a reality.
The design of such systems, however, is a complicated task
Integrated circuit design
Integrated circuit design, or IC design, is a subset of electrical engineering and computer engineering, encompassing the particular logic and circuit design techniques required to design integrated circuits, or ICs...
. There are two main challenges in realizing
mixed-signal ICs. The first challenging task, specific to RFICs, is to fabricate good on-chip passive elements
such as high-Q inductor
Inductor
An inductor is a passive two-terminal electrical component used to store energy in a magnetic field. An inductor's ability to store magnetic energy is measured by its inductance, in units of henries...
s. The second challenging task, applicable to any mixed-signal IC and the subject
of this chapter, is to minimize noise coupling between various parts of the system to avoid any malfunctioning
of the system.
In other words, for successful system-on-chip integration of mixed-signal systems, the
noise coupling caused by nonideal isolation must be minimized so that sensitive analog
circuits and noisy digital circuits can effectively coexist, and the system operates correctly.
To elaborate, note that in mixed-signal
circuits, both sensitive analog circuits and high-swing high-frequency noise injector digital circuits may be
present on the same chip, leading to undesired signal coupling between these two types of circuit via the conductive substrate.
The reduced distance between these circuits, which is the result of constant technology scaling (see Moore's law
Moore's Law
Moore's law describes a long-term trend in the history of computing hardware: the number of transistors that can be placed inexpensively on an integrated circuit doubles approximately every two years....
and the International Technology Roadmap for Semiconductors
International Technology Roadmap for Semiconductors
The International Technology Roadmap for Semiconductors is a set of documents produced by a group of semiconductor industry experts. These experts are representative of the sponsoring organisations which include the Semiconductor Industry Associations of the US, Europe, Japan, South Korea and...
),
exacerbates the coupling.
The problem is severe, since signals of different nature and strength interfere,
thus affecting the overall performance, which demands higher clock rates and greater analog
precisions.
The primary mixed-signal noise coupling problem comes from fast-changing digital signals
coupling to sensitive analog nodes.
Another significant cause of undesired signal
coupling is the Crosstalk (electronics)
Crosstalk (electronics)
In electronics, crosstalk is any phenomenon by which a signal transmitted on one circuit or channel of a transmission system creates an undesired effect in another circuit or channel...
between analog nodes themselves owing to
high-frequency/high-power analog
signals.
One of the media through which mixed-signal noise coupling occurs is the substrate.
Digital operations cause fluctuations in the underlying substrate voltage, which spreads
through the common substrate causing variations in the substrate potential of sensitive
devices in the analog section.
Similarly, in the case of crosstalk between analog nodes, a signal can couple from one
node to another via the substrate.
This phenomenon is referred to as substrate coupling or substrate noise coupling.
Modelling, analysis, and verification of mixed signal coupling
There is a sizeable literature on substrate, and mixed signal coupling. Some of the most common topics are:- Differentiating between the random noise inherent to electronic devices and the deterministic noise generated by circuits.
- Examining the physical phenomena responsible for the creation of undesired signals in a digital circuit and the mechanisms of their transport to other parts of the system. The substrate is the most common coupling mechanism, but capacitive coupling, mutual inductance, and coupling through power supplies are also analyzed.
- Comparing various modeling approaches and simulation techniques. There are many possible models for digital noise generation, the substrate impedance network, and the sensitivity of the (unintended) receiver. The chosen techniques significantly influence the speed and accuracy of the analysis.
- Substrate and mixed-signal analysis techniques can be applied to placementPlacement (EDA)Placement is an essential step in electronic design automation - the portion of the physical design flow that assigns exact locations for various circuitcomponents within the chip’s core area...
and power distribution synthesis.