System in package
Encyclopedia
A system-in-a-package or system in package (SiP), also known as a Chip Stack MCM
, is a number of integrated circuit
s enclosed in a single package
or module. The SiP performs all or most of the functions of an electronic system
, and are typically used inside a mobile phone
, digital music player, etc. Die
s containing integrated circuits, may be stacked vertically on a substrate
. They are internally connected by fine wire
s that are bonded to the package. Alternatively, with a flip chip
technology, solder bumps are used to join stacked chips together.
SiP dies are stacked vertically, unlike slightly less dense multi-chip module
s, which place dies horizontally alongside one another. SiP connects the dies with standard off-chip wire bonds
or solder bumps, unlike slightly denser three-dimensional integrated circuit
s which connect stacked silicon dies with conductors running through the die.
An example SiP can contain several chips—such as a specialized processor
, DRAM
, flash memory
—combined with passive components—resistor
s and capacitor
s—all mounted on the same substrate. This means that a complete functional unit can be built in a multi-chip package, so that few external components need to be added to make it work. This is particularly valuable in space constrained environments like MP3 players and mobile phones as it reduces the complexity of the printed circuit board
and overall design. Despite its benefits, this technique decreases the yield of fabrication since any defective chip in the package will result in a non-functional packaged integrated circuit, even if all other modules in that same package are functional.
Multi-Chip Module
A multi-chip module is a specialized electronic package where multiple integrated circuits , semiconductor dies or other discrete components are packaged onto a unifying substrate, facilitating their use as a single component...
, is a number of integrated circuit
Integrated circuit
An integrated circuit or monolithic integrated circuit is an electronic circuit manufactured by the patterned diffusion of trace elements into the surface of a thin substrate of semiconductor material...
s enclosed in a single package
Chip carrier
A chip carrier, also known as a chip container or chip package, is a container for a transistor or an integrated circuit. The carrier usually provides metal leads, or "pins", which are sturdy enough to electrically and mechanically connect the fragile chip to a circuit board. This connection may be...
or module. The SiP performs all or most of the functions of an electronic system
Electronic System
Electronic System is a Belgian synthesizer group .Disco Machine is an album of seven original compositions from Dan Lacksman, who’s better known as being part of the group, TELEX. This material was first recorded in 1977.- External links :*...
, and are typically used inside a mobile phone
Mobile phone
A mobile phone is a device which can make and receive telephone calls over a radio link whilst moving around a wide geographic area. It does so by connecting to a cellular network provided by a mobile network operator...
, digital music player, etc. Die
Die (integrated circuit)
A die in the context of integrated circuits is a small block of semiconducting material, on which a given functional circuit is fabricated.Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon or other semiconductor through processes such as...
s containing integrated circuits, may be stacked vertically on a substrate
Wafer (electronics)
A wafer is a thin slice of semiconductor material, such as a silicon crystal, used in the fabrication of integrated circuits and other microdevices...
. They are internally connected by fine wire
Wire
A wire is a single, usually cylindrical, flexible strand or rod of metal. Wires are used to bear mechanical loads and to carry electricity and telecommunications signals. Wire is commonly formed by drawing the metal through a hole in a die or draw plate. Standard sizes are determined by various...
s that are bonded to the package. Alternatively, with a flip chip
Flip chip
Flip chip, also known as Controlled Collapse Chip Connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and Microelectromechanical systems , to external circuitry with solder bumps that have been deposited onto the chip pads...
technology, solder bumps are used to join stacked chips together.
SiP dies are stacked vertically, unlike slightly less dense multi-chip module
Multi-Chip Module
A multi-chip module is a specialized electronic package where multiple integrated circuits , semiconductor dies or other discrete components are packaged onto a unifying substrate, facilitating their use as a single component...
s, which place dies horizontally alongside one another. SiP connects the dies with standard off-chip wire bonds
Wire bonding
Wire bonding is the primary method of making interconnections between an integrated circuit and a printed circuit board during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one PCB to another...
or solder bumps, unlike slightly denser three-dimensional integrated circuit
Three-dimensional integrated circuit
In electronics, a three-dimensional integrated circuit is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit...
s which connect stacked silicon dies with conductors running through the die.
An example SiP can contain several chips—such as a specialized processor
Central processing unit
The central processing unit is the portion of a computer system that carries out the instructions of a computer program, to perform the basic arithmetical, logical, and input/output operations of the system. The CPU plays a role somewhat analogous to the brain in the computer. The term has been in...
, DRAM
Dram
Dram or DRAM may refer to:As a unit of measure:* Dram , an imperial unit of mass and volume* Armenian dram, a monetary unit* Dirham, a unit of currency in several Arab nationsOther uses:...
, flash memory
Flash memory
Flash memory is a non-volatile computer storage chip that can be electrically erased and reprogrammed. It was developed from EEPROM and must be erased in fairly large blocks before these can be rewritten with new data...
—combined with passive components—resistor
Resistor
A linear resistor is a linear, passive two-terminal electrical component that implements electrical resistance as a circuit element.The current through a resistor is in direct proportion to the voltage across the resistor's terminals. Thus, the ratio of the voltage applied across a resistor's...
s and capacitor
Capacitor
A capacitor is a passive two-terminal electrical component used to store energy in an electric field. The forms of practical capacitors vary widely, but all contain at least two electrical conductors separated by a dielectric ; for example, one common construction consists of metal foils separated...
s—all mounted on the same substrate. This means that a complete functional unit can be built in a multi-chip package, so that few external components need to be added to make it work. This is particularly valuable in space constrained environments like MP3 players and mobile phones as it reduces the complexity of the printed circuit board
Printed circuit board
A printed circuit board, or PCB, is used to mechanically support and electrically connect electronic components using conductive pathways, tracks or signal traces etched from copper sheets laminated onto a non-conductive substrate. It is also referred to as printed wiring board or etched wiring...
and overall design. Despite its benefits, this technique decreases the yield of fabrication since any defective chip in the package will result in a non-functional packaged integrated circuit, even if all other modules in that same package are functional.
Suppliers
- AtmelAtmelAtmel Corporation is a manufacturer of semiconductors, founded in 1984. Its focus is on system-level solutions built around flash microcontrollers...
- CeraMicro
- ChipSiP Technology
- STATS ChipPAC LtdSTATS ChipPAC LtdSTATS ChipPAC STATS ChipPAC Ltd. is a service provider of full turnkey semiconductor packaging design, bump, probe, assembly, test and distribution solutions. STATS ChipPAC provides semiconductor packaging and test services to a diversified global customer base servicing the computing,...
- ToshibaToshibais a multinational electronics and electrical equipment corporation headquartered in Tokyo, Japan. It is a diversified manufacturer and marketer of electrical products, spanning information & communications equipment and systems, Internet-based solutions and services, electronic components and...
- Amkor
- Renesas
- SanDiskSanDiskSanDisk Corporation is an American multinational corporation that designs, develops and manufactures data storage solutions in a range of form factors using the flash memory, controller and firmware technologies. It was founded in 1988 by Dr. Eli Harari and Sanjay Mehrotra, non-volatile memory...